INTERMAG 2023

INTERMAG 2023 is jointly sponsored by the IEEE Magnetics Society and the Magnetics Society of Japan. INTERMAG 2023 will take place at the Sendai International Center, in Sendai, Japan from May 15 to May 19, 2023. The conference will be primarily in-person, with on-demand access to pre-recorded content provided afterwards.

INTERMAG is the premier international conference on all aspects of fundamental and applied magnetism. Members of the scientific and engineering communities are invited to attend and to contribute to the technical sessions. The technical program will consist of oral and poster presentations, invited talks and symposia, tutorial sessions and exhibits. For detailed information, please see the Call for Papers.

Sendai is known as the “City of Green” and benefits from a beautiful natural environment, delicious food and unique hot springs. We look forward to welcoming you to Sendai for INTERMAG 2023.

2023-03-01
Manuscript Submission is now Open
Submit Manuscript
2023-02-01
Registration is Now Open
Register Here

2022-11-25
Invited Speaker & Symposia Nominations
2023-01-14
Digest Submission Deadline
2023-01-14
Student Presentation Award Application Deadline
2023-02-01
Conference Registration Opens
2023-02-24
Child Grant & Student Travel Grant Applications
2023-02-17
Author Notifications Sent
2023-03-10
Accepted Author Deadline to Confirm Attendance (In Person or Online)
2023-03-21
Manuscript Submission (Submission period opens 2023-03-01)
2023-04-14
Presentation Upload Deadline
2023-04-14
Presentation & Session Chair Registration Deadline
2023-04-14
Magnetism as Art Submission (Submission period opens 2023-02-01)
2023-05-15
Intermag 2023 Conference (2023-05-15 - 2023-05-19)
2023-05-29
On-Demand Content Available for Viewing (Viewing period ends 2023-08-18)

The first Call for Papers is now available for download, below. The Call for Papers includes detailed information about subject categories, the conference format, publications, awards, and grants.