INTERMAG 2023 is jointly sponsored by the IEEE Magnetics Society and the Magnetics Society of Japan. INTERMAG 2023 will take place at the Sendai International Center, in Sendai, Japan from May 15 to May 19, 2023. The conference will be primarily in-person, with on-demand access to pre-recorded content provided afterwards.
INTERMAG is the premier international conference on all aspects of fundamental and applied magnetism. Members of the scientific and engineering communities are invited to attend and to contribute to the technical sessions. The technical program will consist of oral and poster presentations, invited talks and symposia, tutorial sessions and exhibits. For detailed information, please see the Call for Papers.
Sendai is known as the “City of Green” and benefits from a beautiful natural environment, delicious food and unique hot springs. We look forward to welcoming you to Sendai for INTERMAG 2023.
Invited Speaker & Symposia Nominations
Digest Submission Period
Student Presentation Award Application Deadline
Child Grant & Student Travel Grant Applications
Conference Registration Opens
Magnetism as Art Submission Period
Author Notifications Sent
Manuscript Submission Period
Accepted Author Deadline to Confirm Attendance (In Person or Online)
Presentation Upload Deadline
Presentation & Session Chair Registration Deadline
The first Call for Papers is now available for download, below. The Call for Papers includes detailed information about subject categories, the conference format, publications, awards, and grants.
- Electrical Machines and Power Transformers and Inductors
- Sensors and High-Frequency Devices
- Magnetoelectronic Materials and Phenomena
- Soft Magnetic Materials
- Structured Materials
- Interdisciplinary and Emerging Topics
- Memory, Logic and Data Storage
- Multi-Functional Magnetic Materials and Applications
- Magnetization Dynamics and Micromagnetics
- Hard Magnetic Materials
- Microscopy, Imaging and Characterization